Influence of crystalline defects on nitrogen implantation in copper for surface hardening

Ghenwa Zaher (1) , Xavier Sauvage (1) , Samuel Jouen (1)

1 GPM - Groupe de physique des matériaux

The design of electrical contacts that combine a high electrical conductivity and excellent wear resistance requires the optimization of surface processing. Surface hardening of copper was achieved by nitrogen implantation and the underlying mechanisms were investigated by electron microscopy. Pure copper and a CuSn alloy were implanted with nitrogen in the recrystallized state and after severe plastic deformation. The larger lattice parameter of CuSn

Mots clés: Copper nitrogen implantation crystalline defects hardness; Copper; nitrogen; implantation; crystalline defects; hardness

Domaines: Physique [physics]

Ghenwa Zaher, Xavier Sauvage, Samuel Jouen. Influence of crystalline defects on nitrogen implantation in copper for surface hardening. Scripta Materialia, 2023, 231, pp.115440. ⟨10.1016/j.scriptamat.2023.115440⟩. ⟨hal-04067466⟩