Microstructural and mechanical properties of friction stir welded aluminum/copper lap joints, J. Alloys Compd, vol.460, pp.535-538, 2008. ,
Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Compos. Part B Eng, vol.42, pp.1468-1473, 2011. ,
Investigation of nanostructured aluminum/copper composite produced by accumulative roll bonding and folding process, Mater. Des, vol.51, pp.274-279, 2013. ,
Bimetallic copper-aluminium tube by severe plastic deformation, Scr. Mater, vol.66, pp.1081-1084, 2012. ,
Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip, Trans. Nonferrous Met. Soc. China, vol.27, pp.1019-1025, 2017. ,
Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by accumulative roll bonding (ARB) process, Compos. Sci. Technol, vol.68, pp.2003-2009, 2008. ,
Optimisation of interface formation by shear inclination: Example of aluminium-copper hybrid produced by ECAP with back-pressure, Mater. Des, vol.146, pp.142-151, 2018. ,
Experimental research on applying the copper-clad aluminum tube as connecting tubes of air conditioners, Energy Build, vol.97, pp.1-5, 2015. ,
AC Resistance of Copper Clad Aluminum Wires, IEICE Trans. Commun. E96.B, pp.2462-2468, 2013. ,
Aluminum Windings and Other Strategies for High-Frequency Magnetics Design in an Era of High Copper and Energy Costs, pp.78-84, 2007. ,
Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires, Mater. Sci. Eng. A, vol.528, pp.7103-7106, 2011. ,
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level, Mater. Sci. Eng. A, vol.709, pp.134-138, 2018. ,
URL : https://hal.archives-ouvertes.fr/hal-02174411
Study of the intermetallic growth in copper-clad aluminum wires after thermal aging, Intermetallics, vol.50, pp.34-42, 2014. ,
Formation of ultra-fine copper grains in copper-clad aluminum wire, Scr. Mater, vol.63, pp.488-491, 2010. ,
Experimental description of the Al-Cu binary phase diagram, Metall and Mat. Trans A, vol.50, pp.3805-3815, 2019. ,
Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites, Trans. Nonferrous Met. Soc. China, vol.26, pp.3283-3291, 2016. ,
Investigation of interfacial reactions in thin film couples of aluminum and copper by measurement of low temperature contact resistance, Thin Solid Films, vol.65, pp.381-391, 1980. ,
Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J. Alloys Compd, vol.390, pp.212-219, 2005. ,
Controlling of IMCs layers formation sequence, bond strength and electrical resistance in AlCu bimetal compound casting process, Mater. Des, vol.108, pp.343-353, 2016. ,
A technique for rapid characterization of intermetallics and interfaces, Intermetallics, vol.7, pp.1001-1009, 1999. ,
Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J. Alloys Compd, vol.319, pp.233-241, 2001. ,
An approach for fabrication of Al-Cu composite by high pressure torsion, Mater. Lett, vol.236, pp.51-55, 2019. ,
Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization, J. Electron. Mater, vol.39, pp.124-131, 2010. ,
A direct comparison of annealing in TEM thin foils and bulk material: application to Zr-2, Mat. Charact, vol.151, pp.175-181, 2019. ,
Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds, Acta Mater, vol.59, pp.5661-5673, 2011. ,
New observation of nanoscale interfacial evolution in micro Cu-Al wire bonds by in-situ high resolution TEM study, Scripta Mater, vol.115, pp.1-5, 2016. ,
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing, Microelectron. Reliab, vol.55, pp.2316-2323, 2015. ,
Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method, Mater. Des, vol.155, pp.366-374, 2018. ,
URL : https://hal.archives-ouvertes.fr/hal-02061499
, Thermodynamics, Diffusion and the kirkendall effect in solids, 2014.
, Crystal structure of the orthorhombic U2-Al4Mg4Si4 precipitate in the Al-Mg-Si alloy system and its relation to the ?' and ? phases, vol.390, pp.127-138, 2005.
Transmission electron microscopy of an ultrasonically consolidated copper-aluminum interface, J. Mater. Res, vol.29, pp.1970-1977, 2014. ,
Effect of postweld heat treatment on inhomohgeneity of aluminum/copper rotary friction welded joint, Mat. Res. Express, vol.5, p.96504, 2018. ,
Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J. Mater Sci, vol.46, pp.2467-2473, 2011. ,
Assessment of atomic mobilities of Al and Cu in fcc Al-Cu alloys, CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry, vol.33, pp.761-768, 2009. ,
Mechanism of ?-Fe-Si2 precipitates growthand-dissolution and pyramidal defects' formation during oxidation of Fecontaminated silicon wafers, Journal of Applied Physics, vol.117, p.115302, 2015. ,