Journal Articles
IEEE Transactions on Electromagnetic Compatibility
Year : 2009
Moncef KADI : Connect in order to contact the contributor
https://hal-normandie-univ.archives-ouvertes.fr/hal-02306961
Submitted on : Monday, October 7, 2019-11:05:22 AM
Last modification on : Tuesday, February 7, 2023-2:45:05 PM
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Abhishek Ramanujan, Moncef Kadi, Jean Trémenbert, Frédéric Lafon, Bélahcène Mazari. Modeling IC Snapback Characteristics Under Electrostatic Discharge Stress. IEEE Transactions on Electromagnetic Compatibility, 2009, 51 (4), pp.901-908. ⟨10.1109/TEMC.2009.2029092⟩. ⟨hal-02306961⟩
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