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Journal Articles IEEE Transactions on Electromagnetic Compatibility Year : 2009

Modeling IC Snapback Characteristics Under Electrostatic Discharge Stress

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Physics [physics] Engineering Sciences [physics]

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Submitted on : Monday, October 7, 2019-11:05:22 AM

Last modification on : Tuesday, February 7, 2023-2:45:05 PM

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hal-02306961 , version 1 (07-10-2019)

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Abhishek Ramanujan, Moncef Kadi, Jean Trémenbert, Frédéric Lafon, Bélahcène Mazari. Modeling IC Snapback Characteristics Under Electrostatic Discharge Stress. IEEE Transactions on Electromagnetic Compatibility, 2009, 51 (4), pp.901-908. ⟨10.1109/TEMC.2009.2029092⟩. ⟨hal-02306961⟩

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