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Modeling IC Snapback Characteristics Under Electrostatic Discharge Stress

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https://hal-normandie-univ.archives-ouvertes.fr/hal-02306961
Contributor : Moncef Kadi Connect in order to contact the contributor
Submitted on : Monday, October 7, 2019 - 11:05:22 AM
Last modification on : Friday, January 8, 2021 - 3:42:18 AM

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Abhishek Ramanujan, Moncef Kadi, Jean Trémenbert, Frédéric Lafon, Bélahcène Mazari. Modeling IC Snapback Characteristics Under Electrostatic Discharge Stress. IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2009, 51 (4), pp.901-908. ⟨10.1109/TEMC.2009.2029092⟩. ⟨hal-02306961⟩

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