Experimental characterization of packaged switch devices for RF and millimeter-Wave applications

T.V. Dinh; P. Descamps; D. Pasquet; D. Lesénéchal; S. Wane

Experimental characterization of packaged switch devices for RF and millimeter-Wave applications

T.V. Dinh ¹ P. Descamps ² D. Pasquet ² D. Lesénéchal ² S. Wane ³

1 LaMIPS - Laboratoire de Microélectronique et de Physique des Semiconducteurs

2 CRISMAT - Laboratoire de cristallographie et sciences des matériaux

Abstract : In this paper we present experimental characterization of packaged switch devices in terms of their RF attributes isolation, insertion loss, power consumption, and linearity. Packaging and Board assembly significantly reduce their RF and mm-Wave performances. A broadband experimental setup is developed for the qualification of packaged switch devices accounting for deembedding effects both with on-board/on-package and on-chip probing. Module-based switch devices have been measured then, plastic molding, Si cap, and bonding wires have been sequentially removed to investigate their influences. Different challenges with packaged switch devices are identified and effective solutions are proposed for their qualification. © 2016 IEEE.

Keywords : Chip-Package-PCB Co-Design Circuit testing MEMS multi-port measurement Package/Board Deembedding switches

Type de document :

Communication dans un congrès

Domaine :

Chimie

Chimie / Cristallographie

Chimie / Chimie théorique et/ou physique

Chimie / Matériaux

Liste complète des métadonnées

https://hal-normandie-univ.archives-ouvertes.fr/hal-02184777
Contributeur : Université Normandie <>
Soumis le : mardi 16 juillet 2019 - 11:33:32
Dernière modification le : mercredi 28 août 2019 - 12:50:05

Experimental characterization of packaged switch devices for RF and millimeter-Wave applications

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