Skip to Main content Skip to Navigation
Journal articles

Tuned thermoelectric properties of TiS1.5Se 0.5 through copper intercalation

Abstract : Polycrystalline samples of copper intercalated Cux TiS1.5Se 0.5 (x = 0, 0.025, 0.05 and 0.1) are synthesized by classical high temperature reaction. The resulting powders are successfully densified by using spark plasma sintering. As expected, XRD refinements show that Cu intercalation between TiS1.5Se 0.5 slabs induces an increase in the c lattice parameter. Electrical resistivity and Seebeck coefficient decrease drastically with increasing Cu content, direct consequence of the increased carrier concentration. In parallel, the lattice thermal conductivity of CuxTiS1.5Se 0.5 is significantly reduced compared to unfilled TiS1.5Se 0.5. Overall, the dimensionless thermoelectric figure of merit increases with temperature and reaches a maximum value of 0.54 at 700 K for Cu0.05TiS1.5Se 0.5, the highest value so far observed in layered titanium chalcogenides. © 2015 Elsevier B.V. All rights reserved.
Complete list of metadatas

https://hal-normandie-univ.archives-ouvertes.fr/hal-02184189
Contributor : Elisabeth van T Hof <>
Submitted on : Monday, July 15, 2019 - 6:07:15 PM
Last modification on : Tuesday, July 16, 2019 - 1:28:02 AM

Identifiers

Collections

Citation

R. Nunna, F. Gascoin, E. Guilmeau. Tuned thermoelectric properties of TiS1.5Se 0.5 through copper intercalation. Journal of Alloys and Compounds, 2015, 634, pp.32-36. ⟨10.1016/j.jallcom.2015.02.021⟩. ⟨hal-02184189⟩

Share

Metrics

Record views

31