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Article dans une revue
Microstructure and electrical resistance evolution during sintering of a Ag nanoparticle paste
Abstract : Silver nanoparticle pastes are promising materials for high temperature interconnection particularly above 400 °C. Reliability is a major concern in interconnection and it mainly depends on the behavior under the stress induced by thermal cycling. The joint microstructure is then a crucial parameter for reliability and determines the electrical, mechanical and thermal properties. Here, an investigation procedure is proposed to describe the microstructure of a joint and to monitor its evolution in real-time during the sintering. Combining electron and x-ray diffraction with electrical resistance measurement and secondary ion mass spectroscopy, our method is used on a sample made out of a home-made silver nanoparticle paste. The influence of the chemical composition of the paste on the microstructure is discussed as well as the compatibility of the paste for oxide interconnection. © 2015 IOP Publishing Ltd.
https://hal-normandie-univ.archives-ouvertes.fr/hal-02184156
Contributeur : Elisabeth van T Hof <>
Soumis le : lundi 15 juillet 2019 - 18:06:00
Dernière modification le : mercredi 19 février 2020 - 08:54:02
Contributeur : Elisabeth van T Hof <>
Soumis le : lundi 15 juillet 2019 - 18:06:00
Dernière modification le : mercredi 19 février 2020 - 08:54:02
