Microstructure and electrical resistance evolution during sintering of a Ag nanoparticle paste

J. Scola 1 X. Tassart 1 C. Vilar 1 F. Jomard 1 E. Dumas 2 Y. Veniaminova 2 P. Boullay 3 S. Gascoin 3
1 GEMAC - Groupe d'Etude de la Matière Condensée
2 ILV - Institut Lavoisier de Versailles
3 CRISMAT - Laboratoire de cristallographie et sciences des matériaux
Abstract : Silver nanoparticle pastes are promising materials for high temperature interconnection particularly above 400 °C. Reliability is a major concern in interconnection and it mainly depends on the behavior under the stress induced by thermal cycling. The joint microstructure is then a crucial parameter for reliability and determines the electrical, mechanical and thermal properties. Here, an investigation procedure is proposed to describe the microstructure of a joint and to monitor its evolution in real-time during the sintering. Combining electron and x-ray diffraction with electrical resistance measurement and secondary ion mass spectroscopy, our method is used on a sample made out of a home-made silver nanoparticle paste. The influence of the chemical composition of the paste on the microstructure is discussed as well as the compatibility of the paste for oxide interconnection. © 2015 IOP Publishing Ltd.
Keywords : electronic diffraction high temperature electronics lead-free soldering microstructure silver nanoparticle paste
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Article dans une revue
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https://hal-normandie-univ.archives-ouvertes.fr/hal-02184156
Contributeur : Elisabeth van T Hof <>
Soumis le : lundi 15 juillet 2019 - 18:06:00
Dernière modification le : mercredi 2 octobre 2019 - 11:48:12

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COMUE-NORMANDIE | ENSICAEN | UVSQ | CNRS | GEMAC | ILV | INC-CNRS | UNICAEN | UNIV-PARIS-SACLAY

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J. Scola, X. Tassart, C. Vilar, F. Jomard, E. Dumas, et al.. Microstructure and electrical resistance evolution during sintering of a Ag nanoparticle paste. Journal of Physics D: Applied Physics, IOP Publishing, 2015, 48 (14), pp.145302. ⟨10.1088/0022-3727/48/14/145302⟩. ⟨hal-02184156⟩

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