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Temperature and Dilatation Estimation for Modern Semiconductor Devices

Abstract : This paper presents a new approach for measuring physical variables on micro- electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is realized by a Michelson interferometer coupled with a Charge Coupled Device (CCD) line device. To validate this method, the temperature measurements were directly compared with the results obtained by an infrared camera and by a measurement of variation of I (V). The displacement measurements were compared with those obtained by a laser 3D vibrometer, whose physical principle is completely different. Consistent results were obtained regarding the different techniques.
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Contributor : Eric Joubert Connect in order to contact the contributor
Submitted on : Tuesday, July 9, 2019 - 3:01:51 PM
Last modification on : Tuesday, October 19, 2021 - 4:14:40 PM


  • HAL Id : hal-02178029, version 1


Joubert Eric, O. Latry, Jean-Philippe Roux. Temperature and Dilatation Estimation for Modern Semiconductor Devices. Sensors & Transducers Journal, International Frequency Sensor Association (IFSA), 2015, 184 (1), pp.130-135. ⟨hal-02178029⟩



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