Internal Temperature Measurement of Electronic Components

Eric Joubert; Olivier Latry; Pascal Dherbécourt; Maxime Fontaine; Christian Gautier; Hubert Polaert; Philippe Eudeline

Internal Temperature Measurement of Electronic Components

Eric Joubert ¹ Olivier Latry ¹ Pascal Dherbécourt ¹ Maxime Fontaine Christian Gautier Hubert Polaert Philippe Eudeline ²

1 GPM - Groupe de physique des matériaux

2 Thales Air Systems

Abstract : This chapter presents the results of a study in which the temperature and the microdisplacements of the chip surface of high-frequency power electronic components used in radar and telecommunication systems are measured. Several techniques are applied. Their advantages, disadvantages and shared fields of application are discussed. Results from several samples show that the different approaches converge. The originality of this study is that the measurements of chip surface temperature and displacement are obtained simultaneously. This approach makes it possible to then calculate the thermal resistance of an electronic component and characterize the evolution of this resistance over component lifetime.

Keywords : Calibration measurements Charge coupled device (CCD) Interferometric method Null incidence device Peltier module Temperature measurement

Type de document :

Chapitre d'ouvrage

Domaine :

Physique [physics] / Physique [physics] / Optique [physics.optics]

Liste complète des métadonnées

https://hal-normandie-univ.archives-ouvertes.fr/hal-02173702
Contributeur : Eric Joubert <>
Soumis le : jeudi 4 juillet 2019 - 16:15:57
Dernière modification le : mercredi 9 octobre 2019 - 15:17:53

Internal Temperature Measurement of Electronic Components

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Internal Temperature Measurement of Electronic Components

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