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Internal Temperature Measurement of Electronic Components

Abstract : This chapter presents the results of a study in which the temperature and the microdisplacements of the chip surface of high-frequency power electronic components used in radar and telecommunication systems are measured. Several techniques are applied. Their advantages, disadvantages and shared fields of application are discussed. Results from several samples show that the different approaches converge. The originality of this study is that the measurements of chip surface temperature and displacement are obtained simultaneously. This approach makes it possible to then calculate the thermal resistance of an electronic component and characterize the evolution of this resistance over component lifetime.
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Contributor : Eric Joubert Connect in order to contact the contributor
Submitted on : Thursday, July 4, 2019 - 4:15:57 PM
Last modification on : Monday, April 4, 2022 - 10:38:02 AM



Eric Joubert, Olivier Latry, Pascal Dherbécourt, Maxime Fontaine, Christian Gautier, et al.. Internal Temperature Measurement of Electronic Components. Abdelkhalak El Hami & Philippe Pougnet (Eds). Embedded Mechatronic Systems 1, Elsevier, pp.165-184, 2015, 978-1-78548-013-3. ⟨10.1016/B978-1-78548-013-3.50007-3⟩. ⟨hal-02173702⟩



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